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Heat sinks are mainly used for the cooling of electronic devices, due to their easy fabrication, low cost, and high heat dissipation capacity. The extended fin surfaces of the heat sink were design in different patterns and also arranged in different order to enhance the heat transfer from the system. Intensive work was carried out in the last few years to minimize the size of different electronic types of equipment which creates the problem of heating inside the system. The use of heat sink had overcome the problem of system heating, so it is important to review the parameters of heat sinks. This work investigates the performance and parameters of the different heat sinks.
Keywords:
heat sink, review, process and performance parameters, fins design, working fluid
Cite Article:
"A Review on The Enhancement of Heat Transfer Analysis on Micro Pin-fin in Segmental Baffle Heat Sink", International Journal of Science & Engineering Development Research (www.ijrti.org), ISSN:2455-2631, Vol.7, Issue 5, page no.863 - 866, May-2022, Available :http://www.ijrti.org/papers/IJRTI2205143.pdf
Downloads:
000205063
ISSN:
2456-3315 | IMPACT FACTOR: 8.14 Calculated By Google Scholar| ESTD YEAR: 2016
An International Scholarly Open Access Journal, Peer-Reviewed, Refereed Journal Impact Factor 8.14 Calculate by Google Scholar and Semantic Scholar | AI-Powered Research Tool, Multidisciplinary, Monthly, Multilanguage Journal Indexing in All Major Database & Metadata, Citation Generator